发明名称 Molding material
摘要 According to the present invention, it is possible to provide a molding material, for example, a sealing material for semiconductor-related production apparatuses which comprises a fluorine-containing multi-segment polymer being excellent in mechanical properties (particularly at high temperature), abrasion resistance and transparency and ensuring reduced contamination and reduced gas permeation while maintaining inherent characteristics of a fluorine-containing elastomer such as flexibility, elasticity, sealing property, chemical resistance and heat resistance. A molding material comprising a fluorine-containing multi-segment polymer having an elastomeric fluorine-containing polymer chain segment and a non-elastomeric fluorine-containing polymer chain segment, in which the elastomeric fluorine-containing polymer chain segment imparts flexibility to the whole polymer and has perhaloolefin units as a recurring unit in an amount of not less than 95% by mole.
申请公布号 US6635717(B1) 申请公布日期 2003.10.21
申请号 US20000530515 申请日期 2000.07.05
申请人 DAIKIN INDUSTRIES, LTD. 发明人 KISHINE MITSURU;KITAICHI MASANORI;NOGUCHI TSUYOSHI;TANAKA YOSHITO;ARAKI TAKAYUKI;IRIE SADASHIGE
分类号 C08F293/00;C09K3/10;(IPC1-7):C08F259/00 主分类号 C08F293/00
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