| 摘要 |
PROBLEM TO BE SOLVED: To provide a semi-fabricated product structure for a printed circuit board (PCB) and a method of forming the same. SOLUTION: The semi-fabricated product structure is equipped with a first upper foil sheet, a first lower foil sheet, and a first composite sheet with a first dielectric sheet interposed between the upper foil sheet and the lower foil sheet. The first composite sheet has a combination of required materials. The first upper foil sheet is lastly used as an outer layer of the PCB. A first micro via hole is bored in the first lower foil sheet as reaching to the under surface of the first upper foil through the first dielectric sheet. A first conductive layer is formed on the surface of the first dielectric sheet where the first micro via-hole is formed. As a result, a first conductive path is formed by the use of an inverted micro via as extending from the first upper foil sheet to the first lower foil sheet. COPYRIGHT: (C)2004,JPO |
