发明名称 Copper alloy having improved stress relaxation resistance
摘要 A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.</PTEXT>
申请公布号 US6632300(B2) 申请公布日期 2003.10.14
申请号 US20010879616 申请日期 2001.06.12
申请人 OLIN CORPORATION 发明人 BREEDIS JOHN F.;BRAUER DENNIS R.;ROBINSON PETER W.
分类号 C22C9/00;C22F1/08;(IPC1-7):C22C9/04 主分类号 C22C9/00
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