发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 A plurality of N-type first impurity layers (111) are provided that form stripes in a main surface (110S) of a P-type semiconductor substrate (110). At least one N-type second impurity layer (112) overlaps (or touches) one of the first impurity layers (111). A plurality of gate electrodes are provided on a gate insulating film (121). A plurality of gate electrodes form stripes crossing the first impurity layers (111). A plurality of low-resistance wires (140) are provided on an interlayer insulating film (122). The plurality of low-resistance wires (140) form stripes extending in the same direction as that of the first impurity layers (111). An end (123T2) of each contact plug (123) is entirely in contact with the second impurity layer 112, and does not touch a P-type region of the semiconductor substrate (110).
申请公布号 KR20030080177(A) 申请公布日期 2003.10.11
申请号 KR20020077831 申请日期 2002.12.09
申请人 发明人
分类号 H01L21/28;H01L29/772;H01L21/336;H01L21/768;H01L21/8246;H01L21/8247;H01L23/485;H01L23/522;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/28
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