发明名称 |
ELECTRODE ASSEMBLY FOR PROCESSING SEMICONDUCTOR SUBSTRATE AND PROCESSING APPARATUS HAVING THE SAME |
摘要 |
PURPOSE: An electrode assembly for processing a semiconductor substrate and a processing apparatus having the same are provided to prevent the arc discharge generated between electrodes and connecting parts by using a bolt as the connecting part. CONSTITUTION: An electrode assembly for processing a semiconductor substrate is provided with the first electrode(202) connected with a high frequency power supply used for transforming the processing gas of the semiconductor substrate into plasma, the second electrode(204) located at the first surface of the first electrode, and the first connecting part made of the first material having the first conductivity, located for connecting the first electrode with the second electrode. Preferably, the first and second electrode are made of aluminum and the first material is one selected from a group consisting of silver, copper, gold, and aluminum. Preferably, the first connecting part includes a bolt(208) made of the first material.
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申请公布号 |
KR20030078592(A) |
申请公布日期 |
2003.10.08 |
申请号 |
KR20020034312 |
申请日期 |
2002.06.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO, HO;SONG, CHANG BONG;LEE, JUNG MO;CHOI, HYEONG SEOK |
分类号 |
H01L21/205;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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