| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that electromagnetic wave noise is emitted to a high-speed signal at a part where a line conductor comes in and goes out of a hermetically sealed part, in a conventional high-frequency circuit package. <P>SOLUTION: A new high-frequency circuit package is equipped with a lower ground conductor layer 26, an insulating board 21 provided with a mounting part 21a for a high-frequency circuit 28, the line conductor 24 provided near the mounting part 21a and around its periphery, the same plane ground conductor layers 25, and an insulating frame 22 which is joined on the insulating board 21 and where an upper ground conductor layer 27 is formed. Castellation conductors 32 are formed on inner and outer sides of the insulating frame 22 so as to connect the same plane ground conductor layers 25 and the lower ground conductor layer 26 to each other, and a through conductor 33 of ferrite is formed on the insulating board 21 under the castellation conductors 32 so as to connect the same plane ground conductor layer 25 and the lower ground conductor layer 26 in the new high-frequency circuit package. Electromagnetic wave noise can be effectively absorbed and removed by the through conductor 33. <P>COPYRIGHT: (C)2004,JPO</p> |
