发明名称 |
Formation of at least one deep trench structure comprises forming epitaxial silicon film on at least some portions of sidewalls of deep trench to reduce initial dimensions of deep trenches to targeted dimensions |
摘要 |
Formation of at least one deep trench structure comprises providing at least one deep trench having sidewalls that extend to a common bottom wall in a substrate surface, each of the deep trenches having initial dimensions that are wider than targeted dimensions for the deep trenches; and forming an epitaxial silicon film on at least some portions of the sidewalls to reduce the initial dimensions of the deep trenches to the targeted dimensions.
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申请公布号 |
DE10310080(A1) |
申请公布日期 |
2003.10.02 |
申请号 |
DE2003110080 |
申请日期 |
2003.03.07 |
申请人 |
INFINEON TECHNOLOGIES AG;IBM INTERNATIONAL BUSINESS MACHINES CORP., ARMONK |
发明人 |
CHAN, KEVIN;KULKARNI, SUBHASH;MATHAD, GANGADHARA;RANADE, RAIJV M. |
分类号 |
H01L21/308;H01L21/762;H01L21/768;H01L21/8242;(IPC1-7):H01L21/824;H01L21/76 |
主分类号 |
H01L21/308 |
代理机构 |
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