发明名称 MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR CONDUCTIVE PARTICLE ARRANGEMENT FILM
摘要 PROBLEM TO BE SOLVED: To promptly position and arrange a plurality of conductive particles with neither excess nor deficiency. SOLUTION: While an adhesive film 12 is sucked by a suction head 13, air is sucked through each through-hole 12a of the adhesive film 12. Then, while vibrating the conductive particles 14 in a tray 15, the conductive particles 14 are sucked and arranged at each through-hole 12a of the adhesive film 12 on the suction head 13. Thus, each conductive particle 14 is promptly positioned and arrayed on the adhesive film 12 with neither excess nor deficiency. Thereafter, the suction of the adhesive film 12 by the suction head 13 is stopped and the adhesive film 12 is released from the suction head 13. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003273159(A) 申请公布日期 2003.09.26
申请号 JP20020068655 申请日期 2002.03.13
申请人 SEKISUI CHEM CO LTD 发明人 OGAWA AKIHIRO;AKIMUNE MITSUO
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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