LED PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A light emitting diode (LED) package including a carrier, an adhering layer and an LED chip is provided. The adhering layer is disposed on the carrier. The LED chip is disposed on the adhering layer and electrically connected to the carrier. The material of the adhering layer comprises a lead-free tin-based eutectic alloy. Furthermore, a manufacturing method for the LED package is provided.