发明名称 EPOXY RESIN AND CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a novel epoxy resin having a low viscosity, excellent flexibility, pliability, toughness, adhesion, impact resistance and damping property and good curability. SOLUTION: The epoxy resin is represented by formula: G<SB>1</SB>(OR)<SB>m</SB>-O-R<SB>1</SB>- O-(RO)<SB>n</SB>-G<SB>2</SB>(wherein m and n are each a number larger than 1, provided that 3<m+n<6; R is a 2-10C alkylene group; R<SB>1</SB>is (a) a phenylene or naphthylene group or (b) two or three phenylene groups bound via one or two carbon-carbon bonds, ether-oxygen bonds, sulfur atoms, sulfonyl groups, sulfoxide groups, carbonyl groups or 1-5C alkylene or alkylidene groups; and G<SB>1</SB>and G<SB>2</SB>are each a hydrogen atom or a glycidyl group). Here, the epoxy resin wherein G<SB>1</SB>is a hydrogen atom and G<SB>2</SB>is a glycidyl group accounts for 10-90 mol%, and the epoxy resin wherein G<SB>1</SB>and G<SB>2</SB>are both glydicyl groups accounts for 10-90 mol%. The curable resin composition comprises this epoxy resin. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003246837(A) 申请公布日期 2003.09.05
申请号 JP20020049692 申请日期 2002.02.26
申请人 ASAHI KASEI EPOXY KK 发明人 YAMAMOTO HISANAO
分类号 C08G59/20;C08G59/42;(IPC1-7):C08G59/20 主分类号 C08G59/20
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