| 摘要 |
<p>The present invention integrates an inductor (22(A), 22(B), (22(C)) into a semiconductor package by integrally forming inductive segments (22(A), 22(B), 22(C)) in the leadframe (10). The inductive segments(22(A), 22(B), 22(C)) may be connected directly to a lead (12) of the leadframe (10), or indirectly to a lead (12) or a bond pad (10) on a semiconductor die (16) via wirebonds (20) to form an inductor. The inductance value for the resultant inductor is typically controlled by the point of contact for the wirebonds (20) or the leads (12) about the inductive segment (22(A), 22(B), 22(C)). The inductance values may also be controlled by the shape and size of the inductive segments (22(A), 22(B), 22(C)). The leadframe may be formed to support multiple inductive segments, and one or more configurations, including those using one or more die flags (14) to support a like number of semiconductor die.</p> |
