| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection reliability between a semiconductor device and a board employing a BGA connection system without using underfill. SOLUTION: The semiconductor device is provided, on the rear surface thereof, with insular land electrodes connected electrically with the semiconductor device, and a frame-like connection pattern surrounding the outer circumference of the insular land electrodes. COPYRIGHT: (C)2003,JPO
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