发明名称 ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device and an ultrasonic bonding method in which normal bonding operation can be performed without the generation of irregular oscillation when the operation of a vibrator is started. SOLUTION: In an ultrasonic bonding device, an electronic component 3 is pressure-bonded using a ultrasonic wave and a load on a substrate 2 by a bonding tool 7. An operating frequency signal to instruct the operating frequency of a vibrator 6 is outputted depending on different output modes. Moreover, a normal bonding operation can be performed without generating irregular vibration when the operation of the vibrator is started by turning off a frequency tracking function. When the operation of the vibrator 6 is started, the signal of the frequency same as an instruction frequency is outputted as the operation frequency signal, and the frequency tracking function is turned on by outputting, as the operation frequency signal, a compensated frequency signal where compensation is added to the instruction frequency based on the phase comparison result of a current and a voltage. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003243450(A) 申请公布日期 2003.08.29
申请号 JP20020038115 申请日期 2002.02.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TOKUMARU MOTOKAZU
分类号 B06B1/02;B06B1/06;H01L21/60;H01L21/607;(IPC1-7):H01L21/60 主分类号 B06B1/02
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