发明名称 |
BONDING STRUCTURE FOR BONDING SUBSTRATES BY METAL STUDS |
摘要 |
A bonding structure for bonding two substrates by a metal stud includes a first substrate, a second substrate, at least a metal stud and an adhesive. The bonding structure includes a first substrate, a second substrate, at least a metal stud and an adhesive. The metal stud is arranged between the first substrate and the second substrate and attached to the first substrate. The adhesive is applied between the metal stud and the second substrate to electrically connect the metal stud and the second substrate.
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申请公布号 |
US2003161123(A1) |
申请公布日期 |
2003.08.28 |
申请号 |
US20030248405 |
申请日期 |
2003.01.16 |
申请人 |
TONG HO-MING;LEE CHUN-CHI;FANG JEN-KUANG;HUANG MIN-LUNG;CHEN JAU-SHOUNG;SU CHING-HUEI;WENG CHAO-FU;LEE YUNG-CHI;CHOU YU-CHEN;WU TSUNG-HUA;TAO SU |
发明人 |
TONG HO-MING;LEE CHUN-CHI;FANG JEN-KUANG;HUANG MIN-LUNG;CHEN JAU-SHOUNG;SU CHING-HUEI;WENG CHAO-FU;LEE YUNG-CHI;CHOU YU-CHEN;WU TSUNG-HUA;TAO SU |
分类号 |
H05K3/32;H05K3/34;H05K7/10;(IPC1-7):H05K7/10;H05K7/12 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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