APPARATUS AND METHOD FOR SOLDERING

摘要

PROBLEM TO BE SOLVED: To solve the problem that there is possibility of exceeding a guaranteed temperature at a non-heat resistant component when the component is reflow soldered. SOLUTION: The apparatus for soldering by reflow soldering a printed board 20 in which the non-heat resistant component 23 is mounted with a cream solder 22 comprises a second cooling means 31 provided between a preheating means 28 and a heating means 32. Thus, since the temperature of the component is once lowered, the component 23 does not exceed the guaranteed temperature in the heating means. COPYRIGHT: (C)2003,JPO