发明名称 Process for producing heat-resistant intermetallic compound Ni3Al foil having room-temperature ductility and heat-resistant intermetallic compound Ni3Al foil having room-temperature ductility
摘要 A process for producing a heat-resistant intermetallic compound Ni3Al foil having a room-temperature ductility, which comprises a first step of arc-melting an alloy having a chemical composition containing Ni as a main component and Al to form a starting rod, a second step of growing the starting rod in columnar crystal form by unidirectional solidification, a third step of cutting out the unidirectionally solidified rod to form a plate, and a fourth step of cold-rolling the plate cut at room temperature to form a foil. The invention can provide a process for producing a thin Ni3Al foil which has a thickness of 200 microns or less and which is excellent in high-temperature strength, oxidation and corrosion resistances and room-temperature ductility.
申请公布号 US2003136480(A1) 申请公布日期 2003.07.24
申请号 US20020038812 申请日期 2002.01.08
申请人 发明人 HIRANO TOSHIYUKI;DEMURA MASAHIKO
分类号 B21B1/40;B21B3/00;B22D27/04;C22C19/03;C22F1/00;C22F1/10;C30B11/00;C30B13/00;(IPC1-7):C22C19/03 主分类号 B21B1/40
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