| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flat semiconductive resin belt which permits stable transfer and conveyance by ameliorating the winding habit of the belt occurring in a method of manufacturing the semiconductive resin belt and a composition and eliminating the slip of the belt by creep. <P>SOLUTION: A compound of a polyamide resin and amorphous denatured nylon resin is used as a thermoplastic resin to be used for the flat semiconductive resin belt or otherwise after the flat semiconductive resin belt body is formed of the conventional thermoplastic resin, the belt body is heat treated for the prescribed time at above the glass transition temperature of the thermoplastic resin and at a temperature lower by ≥20°C than the melting point thereof. <P>COPYRIGHT: (C)2003,JPO |
