| 发明名称 |
Forced-cooled vehicular electronics assembly comprises moldings with coolant connection, joined to form cavity containing electronic components |
| 摘要 |
The joined moldings (1, 2) include connections (6) for coolant (7) and are joined to form a closed cavity containing at least one electronic components (3).
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| 申请公布号 |
DE10163915(A1) |
申请公布日期 |
2003.07.17 |
| 申请号 |
DE20011063915 |
申请日期 |
2001.12.22 |
| 申请人 |
CONTI TEMIC MICROELECTRONIC GMBH |
发明人 |
GEORGE, DIETRICH;SCHIRMER, EDMUND |
| 分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 地址 |
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