| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package, in which short-circuit will not be generated between a lead frame for external connecting terminals and a metallic plate for dissipating heat. SOLUTION: In the semiconductor package 10 having a base board 11, provided with lead frames 15 for external connecting terminals, annular ceramic frame bodies 16 and a metallic plate 17 for dissipating heat, and a lid body 12 for sealing by a resin 14, the base body 11 is provided with connecting materials for connecting the lead frames 15 to the metallic plates 17 through metallized layers 18a, 18b formed on both surfaces of the ceramic frame body 16. In this case, either one of a first connecting material for connecting the lead frames 15 to the ceramic frame bodies 16 or a second connecting material for connecting the ceramic frame bodies 16 to the metallic plates 17 is provided with a connecting material consisting of a gold braze 20 while the other one of them is provided with the connecting material consisting of a silver braze 19. COPYRIGHT: (C)2003,JPO |
