| 摘要 |
An assembly, including a tool for measuring an applied force and its centroid relative to the center of the tool. A method of measuring and adjusting a force and its centroid applied to a semiconductor chip in a socket by an abutting heat sink consisting of the steps of inserting the tool in the socket, applying a heat sink on the tool, measuring the applied force and its centroid with respect to the center of the tool, adjusting the heat sink until the centroid of the applied force is substantially aligned with the center of the tool, removing the heat sink and tool, from the socket, substituting a semiconductor chip for the tool and reapplying the heat sink whereby the centroid of the force applied by the heat sink is substantially aligned with the center surface of the semiconductor chip in the semiconductor device.
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