| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity in exposure and resolution of a resist pattern after development, giving a tough cured film free of break for tenting and having good plating resistance. <P>SOLUTION: The photosensitive resin composition is prepared which is characterized in containing (a) 20 to 90 mass% resin for a binder comprising a linear polymer having a carboxyl group content of 100 to 600 (expressed in terms of acid equivalent) and a weight average molecular weight of 20,000-500,000, (b) 9 to 79 mass% photopolymerizable unsaturated compound containing a specified compound, (c) 0.005 to 0.5 mass% N-aryl-α-amino acid compound as a photopolymerization initiator and (d) 0.005 to 0.5 mass% basic dye. <P>COPYRIGHT: (C)2003,JPO |
