发明名称 Method and apparatus for endpoint detection during chemical mechanical polishing
摘要 An apparatus for in situ CMP endpoint detection is presented which includes a probe member for emitting and receiving light signals, a transparent plug mounted over the end of the probe, and a support member located about, and slidably engaged with, the outer circumference of the probe. In use, the plug is inserted into an opening in a polishing pad so that the top of the plug is recessed or coplanar with respect to the polishing surface of the pad and the support member is inserted into an opening in a platen such that a seal is formed between the platen and the support member. The probe member, plug, and/or support member may be disposable and replaceable either alone or in combination.
申请公布号 US6586337(B2) 申请公布日期 2003.07.01
申请号 US20010035519 申请日期 2001.11.09
申请人 SPEEDFAM-IPEC CORPORATION 发明人 PARIKH PRABODH J.
分类号 B24B37/04;B24B49/12;B24D7/12;(IPC1-7):H01L21/302;H01L21/461 主分类号 B24B37/04
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