发明名称 PLATING FILM-FORMING APPARATUS AND CONTROL METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a forming apparatus of plating film for constantly and accurately monitoring the composition of a plating liquid by a simple method, and to provide a controlling method of the forming apparatus. SOLUTION: The plating film-forming apparatus comprises a plating-forming bath 1 for performing plating inside, a plating liquid replenishment bath 2 for adjusting the plating liquid to be used in the plating-forming bath 1, a horizontal channel 3 as a channel for connecting the plating-forming bath 1 to the plating liquid replenishment bath 2 so that the plating liquid can be circulated, an X-ray tube 5 for applying X rays toward the plating liquid in the channel, and an X-ray detector 6 for detecting fluorescent X rays radiated from the plating liquid in the channel. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003166955(A) 申请公布日期 2003.06.13
申请号 JP20010365825 申请日期 2001.11.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEHARA YASUSHI;KUROKI HIROSHI
分类号 G01N23/223;C23C18/16;C23C18/31;C25D17/00;C25D21/12;C25D21/14;G01T1/36;(IPC1-7):G01N23/223 主分类号 G01N23/223
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