发明名称 HIGH FREQUENCY CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a high frequency circuit board to transmit frequency signals of higher frequency band, by reducing the distance between a grounded coaxial conductor and a coaxial conductor, and preventing short-circuiting between an internal conductor layer and an internal grounded conductor layer. SOLUTION: The circuit board is provided with a dielectric substrate 1, first and second coplaner lines at the upper and lower surfaces of the substrate 1, respectively, the internal conductor layer 4a of substantially circular shape, a coaxial conductor 4 that penetrates through the center of the internal conductor layer 4a, a plurality of internal grounding conductor layers 5a each having substantially circular shape, which are formed on the circumference centering the internal conductor layer 4a with substantially a given distance therebetween, and a plurality of grounded coaxial conductors 5 which, respectively, penetrate through the centers of the internal grounded conductor layers 5a. Each internal grounded conductor layer 5a is formed around each grounded coaxial conductor 5, so as to have a shape in which an annular conductor layer cuts a portion at the side of the coaxial conductor 4 along a radius R. The angle made by a line L between a center C1 of the coaxial conductor 4 and a center C2 of the grounded coaxial conductor 5 and the radius R is rendered to be 90 to 120°at the side of the conductor layer. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003163309(A) 申请公布日期 2003.06.06
申请号 JP20010362177 申请日期 2001.11.28
申请人 KYOCERA CORP 发明人 KUSANO TAMIO
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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