| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an abrasive of a CMP technique for planarizing an interlayer insulating film and an insulating film for shallow-trench separation, which enables efficient and high-speed polishing, and to provide a manufacturing method therefor. SOLUTION: The CMP abrasive comprises ceric oxide particles, water-soluble polymer and water. After production of the CMP abrasion, secondary particles of the ceric oxide particles are allowed for at least four hours to keep their size 70 to 150% that obtained at the time of production.</p> |
