发明名称 DICING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a dicing apparatus, in which measured results are rapidly fed back by automatically measuring the thickness of a work and automatically rewriting the work data stored in a memory. SOLUTION: This dicing apparatus 10 comprises a measuring means 51 that measures the thickness of the work W placed on a worktable 25 and a work- data rewriting means 52 that feedbacks the work thickness measured by the measuring means 51 to the work data stored beforehand. Thereby, the thickness of the work W is automatically measured, and the measured result is automatically registered to the work data or correction of the registration is automatically made. The thickness measurement means 51 is constituted by a non-contact laser length-measuring device 51A and a thickness-calculating means 51B, wherein the laser length-measuring device 51A is attached on a biobjective microscope 12, enabling measurement of the whole surface.
申请公布号 JP2003151923(A) 申请公布日期 2003.05.23
申请号 JP20010348615 申请日期 2001.11.14
申请人 TOKYO SEIMITSU CO LTD 发明人 ASANO TAKAYUKI;SAKATANI YASUYUKI;FUKUOKA KAZUYA;HIRUTA TOMOAKI
分类号 B23Q17/20;B23Q17/24;H01L21/301;(IPC1-7):H01L21/301 主分类号 B23Q17/20
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