| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which readily absorbs uneven height of bumps by permitting an interconnection pattern to readily enter the bumps and a method for manufacturing the same, and provide a circuit board and electronic equipment. SOLUTION: The semiconductor device is provided with a semiconductor chip 10 on which the bumps 14 are formed, and a substrate 20 for mounting the semiconductor chip 10, in which an interconnection 30 having bonding portions 32 to be connected to the bumps 14, respectively, is formed. Each of the bonding portions 32 is provided with a tapered part 37 in which an upper portion 34 of the bump 14 is made smaller than a base portion 36 of the substrate 20. The upper portion 34 of the bonding portion 32 is permitted to enter the bump 14.
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