发明名称 |
Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device |
摘要 |
A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The semiconductor wafer can be preferably used for producing a chip-sized semiconductor device provided with columnar electrodes to which an external connection terminal, such as a solder ball, is to be bonded. Methods of producing the semiconductor wafer and device by use of plating are also disclosed. |
申请公布号 |
US2003096495(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20020323645 |
申请日期 |
2002.12.20 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
IHARA YOSHIHIRO;KOBAYASHI TSUYOSHI;WAKABAYASHI SHINICHI |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44;H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|