| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein, when a resin layer cannot be formed on the surface of a semiconductor element of an optical element such as an inter-line type CCD, CMOS sensor or the like, the element must be housed in the package of a hollow structure. SOLUTION: In this semiconductor device, first and second conductive wiring parts 24, 25 are formed on the upper and lower parts of an insulating resin 23, the semiconductor element 28 is fixed onto an insulating resin sheet 22 realizing a multilayer structure, and the element 28 is electrically connected to the bonding pad 31 via a bonding wire 32. The element 28 or the like is realized in the hollow structure by disposing the element 28 or the like in a recess 34 formed of a frame 35 and a glass plate 36 or the like. Further, a transparent resin capable of obtaining spectral characteristics of a desired light is coated on the overall surface of the plate 36, and general purpose properties can be improved by various types of transparent resins. |
