PHOSPHORUS AND SILICON MODIFIED FLAME RETARDANT EPOXY RESIN

摘要

PURPOSE: A phosphorus and silicon modified flame retardant epoxy resin is provided, to improve the flame retardancy of the epoxy resin applied to the preparation of a printed circuit board, without introducing halogen. CONSTITUTION: The phosphorus and silicon modified epoxy resin is prepared by reacting an epoxy resin selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol S epoxy resin, a bisphenol M epoxy and a bisphenol AD epoxy resin, with a compound represented by the formula 1 to obtain a phosphorus modified epoxy resin; and reacting the phosphorus modified epoxy resin with the compound represented by the formula 3, wherein x, y and z are 0, 1 or 2, respectively. The content of phosphorus is 1.0-3.2 wt% and the content of silicon is 0.5-2.2 wt% in the phosphorus and silicon modified epoxy resin.