| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor wherein the inspection of a semiconductor wafer is performed simultaneously with performing a semiconductor manufacturing process to the semiconductor wafer. SOLUTION: A first vessel wherein a specified number of semiconductor wafers are accommodated and identifying information is applied and a second vessel to which the identifying information is applied are installed in first processing equipment, and the identifying information on the respective vessels is stored. A part of semiconductor wafers to which the first processing has been performed is accommodated as a wafer for inspection in the second vessel, while the first processing is performed to the semiconductor wafers by using the first processing equipment. The second vessel is installed in inspection equipment, and the inspection of the wafer for inspection is performed. The first vessel wherein the first processing has been performed and the second vessel wherein the inspection has been performed are installed in second processing equipment, and identifying information on the respective installed vessels and the stored identifying information of the respective vessels are compared with each other. The second processing is performed to the other semiconductor wafers and the wafer for inspection by using the second processing equipment, and the wafer for inspection is returned to the first vessel. |
