发明名称 High-frequency wiring board
摘要 A high-frequency wiring board of the present invention is characterized in that W1>W2 and S1>=S2 are satisfied in which W1 is a line width of a portion having a predetermined characteristic impedance of a line conductor, W2 is a conductor width of the line conductor in proximity to a connection of one end of the line conductor to a through conductor, S1 is an interval between the portion having the line width W1 of the line conductor and a same plane ground conductor, and S2 is an interval between the portion of the one end of the line conductor in proximity to the connection to the through conductor and the same plane ground conductor.
申请公布号 US2003077924(A1) 申请公布日期 2003.04.24
申请号 US20020278579 申请日期 2002.10.22
申请人 KYOCERA CORPORATION 发明人 SHIRASAKI TAKAYUKI
分类号 H01L23/12;H01L23/66;H01P1/04;H01P3/08;H05K1/02;H05K3/42;H05K3/46;(IPC1-7):H05K1/00 主分类号 H01L23/12
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