| 摘要 |
PROBLEM TO BE SOLVED: To obtain a mounting structure of IC chip and a display in which an IC chip is mounted, in flip-chip structure, on a wiring board while being protected not to be exposed to the outside and heat generated from the IC chip can be dissipated effectively. SOLUTION: The mounting structure of an IC chip comprises at least one IC chip 58 having a first surface on which an electrode is formed and a second surface opposite to the first surface, a wiring board 40 mounting the IC chip and having wiring being connected with the electrodes of the IC chip, a protective member 66 being fixed to the wiring board and having an opening for exposing the second surface of the IC chip, and a resin member 68 of good thermal conductivity disposed at the opening of the protective member such that it can touch the second surface of the IC chip. |
