发明名称 Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum
摘要 In a semiconductor device, which comprises a capacitor component comprising a first electrode, an oxide film with a high dielectric constant or ferroelectricity in contact with the first electrode and a second electrode in contact with the oxide film, as formed in this order, on one principal side of a silicon substrate with a metal wiring layer formed thereon, such problems as breaking of tungsten interconnect, lowering of reliability, lowering of yield, etc. of semi-conductor devices can be solved by using molybdenum-containing tungsten as the material of metal interconnect layer.
申请公布号 US6548904(B2) 申请公布日期 2003.04.15
申请号 US20020252685 申请日期 2002.09.24
申请人 HITACHI, LTD. 发明人 IWASAKI TOMIO;MIURA HIDEO;NAKAJIMA TAKASHI;OHTA HIROYUKI;NISHIHARA SHINJI;SAHARA MASASHI
分类号 H01L27/105;H01L21/02;H01L21/8242;H01L21/8246;H01L23/532;H01L27/108;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L27/105
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