TIN-BISMUTH ALLOY PLATING APPARATUS AND PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a tin-bismuth alloy plating apparatus which is capable of applying tin-bismuth alloy plating of a stable bismuth concentration by effectively using the bismuth of a plating solution containing the bismuth of a high concentration and is capable of suppressing the formation of a lance-like deposit and a plating method. SOLUTION: This tin-bismuth alloy plating apparatus 40 is furnished with an anode 43 and cathode to be immersed into the plating solution 41 held in a plating bath 42 and voltage impressing means for impressing a voltage to the anode 43 and the cathode and applies the tin-bismuth alloy plating to a member 1 to be plated which is held in the plating solution 41, in which at least the surface of the anode 43 consists of a material nobler than the bismuth and the voltage impressing means impresses the pulse voltage to the electrodes.