发明名称 |
Low-force electrochemical mechanical processing method and apparatus |
摘要 |
The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface. |
申请公布号 |
AU2002343455(A1) |
申请公布日期 |
2003.04.07 |
申请号 |
AU20020343455 |
申请日期 |
2002.09.27 |
申请人 |
NUTOOL, INC. |
发明人 |
JEFFREY A. BOGART;CYPRIAN E. UZOH;BULENT M. BASOL |
分类号 |
C25D5/06;B23H5/08;B24B37/04;B24B49/16;C23F1/08;C25D5/22;C25D7/12;H01L21/304;H01L21/3205;(IPC1-7):C25D5/22;C25F7/00 |
主分类号 |
C25D5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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