发明名称 COATING FILM FORMING METHOD
摘要 PURPOSE: To provide a coating film forming method which realizes reduction of the coarse portion and reduction of coarse density and forms a uniform interlayer coating film, even on a portion where the gap between wirings is less than 0.13 μm. CONSTITUTION: A rotatable inner cup is arranged in an outer cup, the upper face openings of the outer cup and the inner cup are closed by each lid body and the lid body for the inner cup sets a substance to be treated, where a wiring is formed in the inner cup of a rotating cup type coating device supporting, so as to rotate integrally with the inner cup. After a SOG is coated on the surface of the substance to be treated, the upper face openings of the inner cup and the outer cup are closed by the lid bodies and the SOG is diffused uniformly by rotating the inner cup keeping this state. After the coating is repeated several times, the substance to be coated by the SOG is baked by a heat treatment apparatus.
申请公布号 KR20030026886(A) 申请公布日期 2003.04.03
申请号 KR20020057978 申请日期 2002.09.25
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 ENDO HIROKI
分类号 H01L21/768;H01L21/00;H01L21/31;H01L21/3105;H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/768
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