| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor having low cutting resistance, readily separated into pieces, and causing little abrasion of an edge at the time of separation into pieces by cutting a molded article after collectively sealing semiconductor elements each having a metal frame, and to provide a semiconductor device. SOLUTION: The epoxy resin composition for sealing the semiconductor comprises as essential ingredients (A) a crystalline epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) a metal hydroxide containing at least 20 wt.% of water of crystallization and/or a metal hydroxide solid solution containing at least 20 wt.% of water of crystallization, and (E) an inorganic filler, where the metal hydroxide (D) containing at least 20 wt.% of water of crystallization and/or the metal hydroxide solid solution containing at least 20 wt.% of water of crystallization accounts for at least 0.5 wt.% of the whole epoxy resin composition.
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