SOI WAFER LASER MARK PRINTING METHOD AND SOI WAFER

摘要

PROBLEM TO BE SOLVED: To provide an SOI wafer laser mark printing method which is capable of printing a laser mark which can be accurately read by an optical character reader on an SOI wafer and the SOI wafer. SOLUTION: A laser mark is printed on either the surface of a SOI layer or a terrace of the surface of a base wafer after an SOI wafer is finished (1), or a part covering a laser mark printed area on a base wafer out of a bond wafer is removed, and an opening which uncovers the laser mark printed area is formed (2), or a laser mark is previously printed on a region of the surface of the base wafer which does not overlap with the bond wafer before a base wafer and a bond wafer are bonded together (3), or a part of a bond wafer overlapping with a laser mark printed area is removed before a base wafer where a laser mark is previously printed and a bond wafer are bonded together (4).