发明名称 |
METHOD FOR MAKING ELASTIC BUMPS |
摘要 |
<p>This invention relates to a manufacturing process for making elastic bumps in the micro-electronic field. It solves the problem to mould micrometer sized elastic features by means of a micro-machined mould. The method is a reproducible moulding technology to achieve elastic bumps being a perfect replication of the mould. The mould is made of one or several grooves etched in a silicon wafer. The method includes the steps of: cleaning the surface of the mould (100) from dust and other particles; depositing a release agent on the mould and the release agent, e.g. Parylene or silane, forming a conformal self-assembled layer (118) on the surface of the mould; putting on a curable elastomer, to form an elastomeric structure (208) on the mould; curing the mould and the structure; and separating the structure from the mould.</p> |
申请公布号 |
EP0954420(B1) |
申请公布日期 |
2003.03.12 |
申请号 |
EP19970951402 |
申请日期 |
1997.12.19 |
申请人 |
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) |
发明人 |
HESSELBOM, LILLEBROR, HJALMAR;BODOE, JAN, PETER |
分类号 |
B29C33/38;B29C33/42;B29C33/58;B29C33/62;B29C33/64;(IPC1-7):B29C33/58 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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