发明名称 IC MOUNTING BODY
摘要 PROBLEM TO BE SOLVED: To provide an IC mounting body elongating the serviceable life by preventing corrosion of an antenna constituting an IC module in the IC mounting body. SOLUTION: This IC mounting body is so formed that an IC chip 21 and an inlet holding the antenna 22 electrically connected to the IC chip 21 are stacked on a display substrate 11 via a pressure sensitive adhesive layer 12, the pressure sensitive adhesive layer 12 positioned in the opposite side of a surface side having the inlet and a release paper 13 protecting the pressure sensitive adhesive layer 12 are provided, and the ratio of carboxylic acid containing monomer in the pressure sensitive adhesive layer 12 is 2 mass% or less.
申请公布号 JP2003067714(A) 申请公布日期 2003.03.07
申请号 JP20010260338 申请日期 2001.08.29
申请人 OJI PAPER CO LTD 发明人 FUJIKI YASUTAKE
分类号 B42D15/10;C09J201/00;G06K19/07;G06K19/077;G09F3/00;G09F3/10 主分类号 B42D15/10
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