| 摘要 |
Described are heating members and related methods, the heating members being usefully for processing substrates such as microelectronic devices, the heating members optionally and preferably comprising a thermal conductive layer prepared to a superior flatness and having thermal transfer properties that facilitate rapid, agile, and uniform heat transfer, with ceramic material being preferred for its construction, and the heating member optionally and preferably including a multi-layer heating element.
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