发明名称 PRINTED BOARD USING ULTRA-THIN HIGH-SILICON STEEL PLATE
摘要 PROBLEM TO BE SOLVED: To provide a printed board having superior electromagnetic wave noise shielding characteristic. SOLUTION: The ultra thin high-silicon steel plate, whose Si content is >=5% and <=7%, and whose thickness is <=0.3 mm, is used in this printed board. At least one or more ultra-thin high-silicon steel plates are used in this printed board, the high-silicon steel plate has a Si-concentration gradient in the plate- thickness direction, the Si-concentration at the surface layer is higher than that at the central part of the steel-plate, the difference between the Si contents at the surface layer and at the central part of the steel-plate is >=0.5%, the average Si content in the plate-thickness direction is >=3% and <=7%, and the plate thickness is <=0.3 mm.
申请公布号 JP2003060322(A) 申请公布日期 2003.02.28
申请号 JP20020163817 申请日期 2002.06.05
申请人 NKK CORP 发明人 TATAI MASANOBU;ABE MASAHIRO;TSUKAMOTO HIDEO;TAKADA YOSHIICHI;YAMAJI TSUNEHIRO
分类号 H05K1/05;H05K3/46;(IPC1-7):H05K1/05 主分类号 H05K1/05
代理机构 代理人
主权项
地址
您可能感兴趣的专利