| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for winding up type dry etching which dispenses with desmear treatment in via hole formation in a build up process of high density packaging technique, can answer to various patterns and can attain low cost of etching treatment. SOLUTION: The inside of a vacuum chamber 1 is divided to a winding out/winding up chamber 1a of a film-shaped matter to be treated 15, an etching processing chamber 1b and an intermediate chamber 1c between these both chambers and a vacuum degassing system 4 is disposed at each chamber. A main roller 5 on which the film-shaped matter to be treated 15 travels is positioned in the intermediate chamber 1c as a cathode electrode and an anode electrode is disposed in the etching processing chamber 1b, an etching gas is supplied from the anode electrode side to the etching processing chamber 1b and the film-shaped matter to be treated 15 is continuously subjected to plasma etching treatment.
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