发明名称 SYSTEM UND VERFAHREN ZUM ANBRINGEN EINES HARZES ZWISCHEN DEN SUBSTRATEN EINER VERBUNDDATENSPEICHERPLATTE
摘要 A system and method dispense (8) resin between substrates (66). A top substrate device holds a top substrate concave up. A bottom substrate device (508) holds a bottom substrate concave down. A resin dispensing device (514) has a needle and dispenses a trajectory of resin defined by an arc having a tangent that touches a tangent of a concave-up-shaped top substrate. The top substrate device (510) may be arranged to include a dampening mechanism to cause a dampened release of the top substrate. Moreover, the top substrate device (510) may be arranged to hold a top substrate so that the top substrate has a continuous concave-up shape extending from a center portion of the top substrate to its outer diameter, and the bottom substrate device may be arranged to hold a bottom substrate so that the bottom substrate has a continuous concave-down shape extending from a center portion of the bottom substrate to its outer diameter.
申请公布号 AT232162(T) 申请公布日期 2003.02.15
申请号 AT19980957819T 申请日期 1998.11.12
申请人 STEAG HAMATECH, INC. 发明人 ROSSIGNOL, BRIAN, C.;PAULUS, JOSEPH, W.;LEBLANC, ARTHUR, W., III;RAMANATHAN, ELANGOVAN
分类号 B25B11/00;B29C35/08;B29C65/00;B29C65/54;B29C65/78;G11B7/26;G11B23/00 主分类号 B25B11/00
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