METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING DRY FILM RESIST

摘要

PURPOSE: A method is provided to improve the resolution and tightness of a resist according to a process change when manufacturing the printed circuit board using a dry film resist. CONSTITUTION: A resist is exposed to light(S40). The resist has a thickness t of 5 micrometer <=t<=100 micrometer but a range of 20 micrometer<=t<=30 micrometer is ruled out. The "t" is thickness of a resist layer between a base film and a cover film of a dry film photoresist. A developing step eliminates a non-exposure part(S50). A heat treatment step(S45) is performed between the exposure step(S40) and the developing step(S50). The heat treatment step(S45) uses one of a heat roll or a heated-air oven. When the heat treatment step(S45) uses the heat roll, the heat roll is heated at a temperature of 80-160°C, at a driving speed of 0.2-5 m/min, and at a pressure of 10-90 psi. When the heat treatment step(S45) uses the heated-air oven, the heated-air oven is heated at a temperature of 30-200°C for 5-600 seconds. A thickness of a resist layer of a dry film photo-resist ranges 5-100 micrometer.