摘要 |
To provide a surface-mounting type electronic circuit unit suitable for miniaturization, circuit elements including capacitors, resistors and inductance elements and a conductive pattern connected to these circuit elements are thinly formed on an alumina substrate, semiconductor bare chips for a diode and a transistor are bonded on a connection land of the conductive pattern via wire, an inductance element composed of a pair of conductors opposite at a predetermined interval on the aluminum board is thinly formed and a unbalance/balance converter is formed by these conductors.
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