APPARATUS OF TESTING INSULATION RELIABILITY OF INTEGRATED CIRCUIT WIRING

摘要

PURPOSE: An apparatus of testing insulation reliability of an integrated circuit wiring is provided to estimate a trouble point of a semiconductor device when an electric field is concentrated at a peripheral wiring of a multi-layer via. CONSTITUTION: One comb pattern(100) is diverged in a vertical direction to a linear axis pattern(110) on the same layer as the axis pattern, and has a plurality of parallel branch patterns(120). Two branch parallel parts(310) are formed on the same layer as the axis pattern(110) and are formed so as to be spaced apart from both sides of the branch patterns. An axis parallel part(320) is formed on another layer between the comb pattern and an interlayer insulation film, and connect one ends of the two branch parallel parts so as to form a vertical bent part together with the two branch parallel parts. A plurality of zigzag pattern connect ends of the two branch parallel parts and both ends of the axis parallel part through the interlayer insulation film, and comprises two via holes(330) spaced apart from a pattern formed by extending the branch pattern parts. One zigzag pattern has a connection portion used to connect the other ends of the two branch parallel parts adjacent to zigzag units. A voltage applying means applies a voltage to the comb pattern and the zigzag pattern.