COATING MATERIAL OF SEMICONDUCTOR CHIP,COATING METHOD OF SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

摘要

A method for coating a semiconductor chip without exposing the corner parts thereof.The coating method characterized by comprising the steps of mounting a coating material having a coating layer of thermosetting resin formed on one side of a basic material on the semiconductor chip while directing the coating layer toward the semiconductor chip side,hot pressing the coating material to soften the coating layer,and then curing the fluidized coating layer while holding by surface tension and covering the side face of the semiconductor chip.