| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounted electronic part which can prevent the flow-in of resin to a through hole, which can be miniaturized and whose manufacture cost can be reduced, and to provide the manufacturing method. SOLUTION: An electronic part element is mounted on the surface of a multiplayer substrate. In the element, a surface electrode pattern formed on the surface of a first resin substrate and an intermediate layer electrode pattern formed on the upper face of a second resin substrate are connected by a via conductor formed in a via hole, and the intermediate layer electrode pattern and a base electrode pattern formed on the base of the second resin substrate are connected by a surface electrode formed in the through hole. Further, sealing resin is formed at the peripheral area of the electronic part element and on the surface of the multiplayer substrate. The first resin substrate is laminated on the second resin substrate so that the opening of the through hole formed on the second resin substrate is blocked by the first resin substrate. |
